Poly E~scrap Mixed Regrind
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Poly E~scrap Mixed Regrind
Regrind mixed plastic scrap free of metal (including screws) and other foreign materials, sorted from dismantled or destructed electronics.
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Poly E~scrap Mixed Regrind
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Poly E~scrap Mixed Regrind
AVAILABLE :
Mixed Scrap Integrated Circuits (IC chips)
- LA1402578
Shipping Pt. / Location:
KOREA, SOUTH, SEOUL SI
WTS-Samsung,SK Hynix.Micron DDR4 Memory IC and R/SO/U/URDimm Module.
1.Samsung/SKHynix/Micron R/SO/U/URDimm Used Tested Grade A- &B stocks. 2.Samsung &SK Hynix DDR4 8Gb Reball IC chips. 3.Brand new SKHynix/Samsung/Micron Moduler. 4.Vender : RAMAXEL. Products : DDR5 SODIMM 8Gb 1R x 16 PC5 5600. Part Number : RMSB3400MH961AF-5600. Condition : Brand New / Master Carton. Q'ty : 2000 Units.
Quantity
Units
Frequency
2000
lbs
Day
Price
Funds
Per Unit
88.08
USD
lbs
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